Samsung’s Exynos 2700 SoC for Galaxy S27 series to reportedly ditch WLP technology | Infinium-tech

According to a recent report, Samsung’s next-generation flagship chipset, the Exynos 2700, may adopt a new packaging design. The company is reportedly planning to move away from fan-out wafer-level packaging (FOWLP) technology for the upcoming SoC.

Fan-out wafer-level packaging (FOWLP), which Samsung has used since the Exynos 2400, has reportedly helped improve thermal performance. However, this technology is said to have been less profitable for the company due to its complex and expensive manufacturing process.

According to the report, which cites an industry official, Samsung plans to adopt a new packaging architecture known as Side-by-Side (SbS) for the Exynos 2700. In this design, the application processor (AP) and DRAM are located next to each other on the substrate rather than being stacked.

The company is also expected to include its Heat Pass Block (HPB) technology in the Exynos 2700, which may help improve heat dissipation and overall thermal efficiency.

Samsung is expected to use the Exynos 2700 in the Galaxy S27 and Galaxy S27+, both of which are likely to launch in early 2027. It will be interesting to see how the chipset’s new packaging design will impact thermal performance and overall efficiency.

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