TSMC’s $6.6B grant from U.S. government finalized | Infinium-tech

In April, the United States Department of Commerce announced $6.6 billion in direct funding for TSMC under the US Chips and Science Act. The subsidy has now been finalized and will include an additional $5 billion in government loans, which will help expand TSMC’s semiconductor production in Phoenix, Arizona. This is the first major binding contract in the Chips and Science program since its inception in 2022.

TSMC Semiconductor Manufacturing Fab Site in Phoenix, Arizona

Under the agreement, government funds will be handed over to TSMC based on a project milestone, with the first $1 billion expected to be transferred before the end of this year.

Today’s final agreement with TSMC – the world’s leading manufacturer of advanced semiconductors – will spur $65 billion of private investment to build three state-of-the-art facilities in Arizona and create thousands of jobs by the end of the decade. This is the largest foreign direct investment in a greenfield project in the history of the United States.

The first of TSMC’s three facilities is on track to fully open early next year, meaning that for the first time in decades an American manufacturing plant will produce the cutting-edge chips used in our most advanced technologies — our smartphones. From to autonomous. From vehicles, to data centers that power artificial intelligence. – US President Joe Biden

The Taiwanese semiconductor contract manufacturer has agreed to increase its investment in its fab in Arizona to $65 billion, the most foreign direct investment in a single project in US history.

According to previous reports, TSMC plans to make 4nm chips in Arizona next year, followed by 3nm chips in 2028 using N2 and A16 nanosheet process technologies. The chipset maker has also committed to opening a third semiconductor factory producing 2nm chips in Arizona by 2030.

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