Samsung to invest more than $7 billion into chip packaging in the US | Infinium-tech

After some hiccups with Samsung’s chip construction business over the years, the company is now scheduled to acquire land in the section. Beyond the South Korea-USA summit on 25 August, Samsung is asked to invest an additional $ 7.2 billion in its chip manufacturing facilities in the United States.

In addition to an investment of $ 37 billion in investment chip construction, an advanced chip will go into a packaging facility. Samsung plans to produce 2Nm and 4Nm chips to meet the demand of new customers like Apple and Tesla. It is also a way to avoid Trump’s tariff.

The company’s original plan included an investment of $ 44 billion, but at that time, the demand for Samsung Chips was low, so the Korean tech veteran decided to leave the chip packaging facility completely. Now, it is back to the menu.

The information has not been officially confirmed, but it seems that the company will announce it during the summit on August 25.

Samsung believes that it can improve competition in the US as it provides a complete manufacturing solution – chip production, chip packaging and memory chip construction. TSMC, for example, provides only chip construction and packaging, while SK Hynix only brings memory chips.

Samsung’s Taylor Fab 1 is almost turned, and is planned to complete construction by the end of this year. However, the equipment required for chip construction will be installed next year.

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