Samsung may have developed a way to keep the Exynos 2600 cooler | Infinium-tech

This week we have seen Exynos 2600 post impressive results on Geekbench and 3DMark. Korea’s reports claim that Samsung has developed a good new trick for this chip – a heat pass block (HPB) that promises to improve the application processor (AP) compared to previous approaches.

A “chipset” is simply arranged in a package-on-package structure that keeps Ram on top of the application processor (it is a silicon dye that holds CPU, GPU, NPU and other components).

The heat pass block adds another layer to that stack – a copper heat sink. It is similar to the heat spreading which are specific in modern designs. However, heat spreaders are added after collecting the package-on-package structure.

The advantage of HPB is that it is very close to the source of heat, which should allow it to pull the heat more efficiently.

An example of package-on-package stacking without HPB

The Exynos 2600 will be fabbed on Samsung’s 2Nm Gate-All-Around (GAA) process and is expected to ship with the Galaxy S26 series. We will not be surprised to see a snapdragon chip in some or all the Galaxy S26 Ultra. However, whether other S26 models get Z Flip7 treatment (exynos in all markets) or whether chip selection varies by market.

Samsung is expected to complete the quality test of Axinos 2600 and should officially unveil the chip around the same time. The Galaxy S26 series should be held in late January or early February.

Source (In Korean)