Kuo: OpenAI phone is closer than we thought, to use a custom Dimensity SoC | Infinium-tech
Last month, analyst Ming-Chi Kuo reported that OpenAI was developing an AI-agent smartphone for mass production in 2028. Now, Kuo suggests that the timeline could be accelerated and has also shared some early specifications of the device.
According to Kuo, OpenAI smartphones are now expected to enter mass production in the first half of 2027. Analysts attribute the accelerated timeline to a potential year-end IPO as well as the growing AI phone market.
Ming-Chi Kuo also shared key specifications of OpenAI’s AI agent-centric smartphone. According to the analyst, MediaTek is likely to be the sole SoC supplier. The device is expected to use an optimized Dimensity 9600 chipset, which will be built on TSMC’s N2P process, in the second half of this year.
Kuo says imaging will be a major focus, with the ISP featuring an advanced HDR pipeline designed to improve real-world scene sensing.
The OpenAI phone is also said to include dual-NPU architecture for AI workloads along with LPDDR6 RAM and UFS 5.0 storage. On the security front, it is expected to support pKVM and inline hashing.
According to Kuo, if the phone’s development remains on track, total shipments could reach 30 million units in 2027 and 2028.
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