Big leak details specs for Google Tensor G5 and G6 | Infinium-tech

Since their inception, Google Tensor chipsets were based on Exynos chips and were produced by Samsung. This is expected to change with next year’s Tensor G5 as Google is expected to switch to TSMC’s process node. Android Authority An extensive report directly related to Google’s gChips division was shared detailing what’s to come from the Tensor G5 and G6 SoCs.

The Tensor G5 (codenamed “Laguna”) will power the upcoming Pixel 10 series and will be manufactured on TSMC’s 3nm-class N3E process. This is the same node that is used for Apple’s A18 Pro chip inside the iPhone 16 Pro series and is arguably the leading process node at the moment.

The Tensor G5 will feature an updated CPU cluster consisting of 1x Arm Cortex-X4 prime core, 5x Cortex-A725 performance cores, and 2x Arm Cortex-A520 efficiency units. Additionally, the GPU will also get up to a dual-core Imagination Technologies (IMG) DXT-48-1536 unit clocked at 1.1 GHz.

The new GPU unit inside the Tensor G5 will support ray tracing – a first for a Tensor chipset – and offer GPU virtualization for accelerated graphics in virtual machines. Google is also expected to offer a 14% improvement in AI tasks thanks to the new NPU.

Tensor G6 (codenamed “malibu”) is expected to be built on TSMC’s upcoming N3P node. Although this is still a 3nm process, it will offer substantial gains in performance, energy efficiency and size. Based on the leaked document, the N3P will offer a 5% increase in frequency compared to the N3E, while also being able to draw 7% less power and take up 4% less surface area.

Source