Samsung Galaxy Z Fold7 passes through the FCC, has its chipset confirmed | Infinium-tech

Samsung’s upcoming Galaxy Z Fold 7, is expected to be expected that Galaxy Z Flip 7 and Flip 7 FE in New York as well as in New York or in mid-July, now certified by FCC. Interestingly, it reveals the chipset that will use in most markets.

The SM-F966B model that was certified is intended to international markets (“B” the suffix tells us in the naming of Samsung), and it is powered by Qualcomm’s Snapdragon 8 Elite Chipset. Therefore, it is more than the possibility that this chip will be inside the fold 7 worldwide, just as all recent rumors have claimed.

This will certainly be a separate position for Flip7, which is expected to mark the onset of Samsung’s long -delayed EXYNOS 2500 SoC, although it is still not clear how many markets will have an appearance (leaks do not agree).

Fold 7 has 5G, Wi-Fi 7, UWB, wireless charging and reverse wireless charging according to FCC. Depending on the previous leak, it will sports an 8.2 -inch foldable AMOLED screen with a 120 Hz refresh rate, a 6.5 -inch FHD+ AMOLED cover display, a 200MP main camera, a 12MP ultravide, a 10 mp ultravido, a 10 mp telephoto, a 10 mp telephoto, a 200MP main camera, a 200MP main camera, a 200MP main camera, a 200MP main camera MP-Disple’s Camera, A10 MP-Deoplay, A10 MP-Dipy, A10 MP-Dipi, A10 MP-Dipi-Dipi, A10 MP-Deop-Deop-Deople, A10MP-DOP-DOP-Disple Camera. Battery. It will run Android 16 with a UI 8 at the top since one day.

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