Micron announces its UFS 4.1 and UFS 3.1 storage chips based on G9 architecture | Infinium-tech

Today Micron announced the world’s first G9-based UFS 4.1 and UFS 3.1 storage solutions for smartphones, enabling more on-device AI features. New storage chips will be available on flagship products immediately after 1y LPDDR5X chips of Micron, which will be available in early 2026.

UFS 4.1 and UFS 3.1 mobile storage chips are based on the G9 process node of the micron and provide better power efficiency and read/write. The capacity will vary between 256GB and 1TB chips and will be suitable for ultra-flour and foldable smartphones.

But in addition to hardware reforms, Micron promises some software tweex that will promote the user experience and improve the performance of some AI functions. For example, UFS 4.1 storage solutions support zoned UFS, improves read-right efficiency and reduce right amplification, while data defractionation UFS improves data transfer and deframentation up to 60%of data within the UFS device. Pinned Rightboster data enables rapid access to data that is located up to 30%on the rightboster buffer. And the eccentric delay tracker automatically debugs by analyzing the delayed log. This final feature is also available at UFS 3.1, while other UFS seems to be exclusive to 4.1 chips.