Huawei tipped to make 3nm chips in 2026 | Infinium-tech
Huawei EUV is developing a true 5 Nm production line without the need for lithography machines. According to a UDN report, in addition, 3 NM chips are already in the R&D phase, with a plan to start production by 2026.
Huawei can not use standard EUV technology, as it is patented by the Dutch company ASML, which is prohibited from working with the Chinese manufacturer. Instead, the company is using SSA800 lithography machines with multi-patterning made by Shanghai Micro Electronics (SMEE).
Research and development for 3Nm chips are following two approaches: one GAA arch (standard one, used by TSMC and Samsung), and the other is a carbon nanotube-based chip that has already completed LAB verification and is now being adapted for SMIC production lines.
Earlier this month, Huawei Matebook Flow arrived, which was powered by Kirin X90. While the company calls it “5Nm chip”, it is a 7Nm design with actually advanced packaging technology. This brings performance at the equal value with other 5 Nm chips, but the yield is only 50%, which is very low, making the chip more expensive for construction.
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